micronet news (Text/Kapok) According to foreign media reports, TSMC recently revealed that its future 3nm process technology development goal is to reach 250 million transistors/mm² in process packaging!
TSMC CEO confirmed that development of the 3nm node is on track, with risk production scheduled for 2021 and volume production starting in the second half of 2022. In addition, TSMC decided to use FinFET transistor technology in 3nm.
Source: WikiChip Fuse
In terms of performance improvement, TSMC's 5nm has a 15% performance improvement and a 30% energy consumption increase over 7nm, while 3nm has a 7% performance improvement and a 15% energy consumption increase over 5nm. The
3nm process is the largest investment in the semiconductor industry over the years, and it is also a key battle in the battle for leadership. It is understood that TSMC’s total investment in 3nm process is as high as NT$1.5 trillion, which is approximately US$50 billion. Just building the factory alone will cost at least US$20 billion.
As TSMC's main competitor, Samsung has never stopped trying to catch up with TSMC. After Samsung fell behind TSMC by a large margin in the 14nm process, TSMC took a big lead in the subsequent 10nm and 7nm processes. Samsung therefore skipped 5nm and directly competed with the 3nm process. , plans to invest US$116 billion by 2030, hoping to surpass TSMC and become the world's largest wafer foundry. (Proofreading/Jurnan)