IT Home July 5 News On July 1, Dongguan Tianyu Semiconductor Technology Co., Ltd. underwent industrial and commercial changes, adding a new shareholder, Huawei-affiliated company Shenzhen Hubble Technology Investment Partnership, and the company’s registered capital increased fro

2024/05/1903:57:32 hotcomm 1513

IT Home July 5 News On July 1, Dongguan Tianyu Semiconductor Technology Co., Ltd. underwent industrial and commercial changes, adding a new shareholder Huawei affiliate Shenzhen Hubble Technology Investment Partnership (limited partnership), and the company was registered at the same time Capital increased from approximately RMB 90.27 million to approximately RMB 97.7 million, an increase of over 8%.

IT Home July 5 News On July 1, Dongguan Tianyu Semiconductor Technology Co., Ltd. underwent industrial and commercial changes, adding a new shareholder, Huawei-affiliated company Shenzhen Hubble Technology Investment Partnership, and the company’s registered capital increased fro - DayDayNews

IT Home July 5 News On July 1, Dongguan Tianyu Semiconductor Technology Co., Ltd. underwent industrial and commercial changes, adding a new shareholder, Huawei-affiliated company Shenzhen Hubble Technology Investment Partnership, and the company’s registered capital increased fro - DayDayNews

Enterprise Chacha information shows that the company was established in 2009, and its legal representative is Li Xiguang. Its business scope includes: R&D, production, and sales: silicon carbide epitaxial wafers, semiconductor materials and devices, etc.

It is reported that Dongguan Tianyu Semiconductor Technology Co., Ltd. is located in Songshan Lake High-tech Industrial Development Park, Dongguan City, Guangdong Province. is my country's first company specializing in the research, development, production and sales of third-generation semiconductor silicon carbide (SiC) epitaxial wafers High-tech enterprise . In 2010, Tianyu Semiconductor cooperated with the Institute of Semiconductors of the Chinese Academy of Sciences to establish the "Silicon Carbide Technology Research Institute", forming a top domestic technological innovation team.

IT House learned that after more than half a century of development, the performance of power semiconductor device based on silicon materials has approached its physical limit. Therefore, the development of third-generation semiconductor materials represented by silicon carbide (SiC), gallium nitride (GaN), etc. has begun to receive attention. A new round of global industrial upgrading has begun and is gradually entering the third-generation semiconductor era.

hotcomm Category Latest News