According to foreign media "wccftech", TSMC's 3-nanometer process is expected to be mass-produced in the second half of 2022, and Samsung remains in the lead here. Due to the close cooperation between TSMC and Apple over the years to promote advanced processes and packaging techn

2024/05/1706:07:33 hotcomm 1682

According to foreign media

According to foreign media "wccftech", TSMC's 3-nanometer process is expected to be mass-produced in the second half of 2022, and Samsung remains in the lead here. Due to the close cooperation between TSMC and Apple over the years to promote advanced processes and packaging technologies, AMD and Qualcomm were dissatisfied with TSMC's Apple-first policy, so they decided to transfer orders to Samsung's 3-nanometer process and became the first wave of customers.

According to foreign media

Judging from the architecture launched by AMD, the Zen 4 architecture blueprint was recently launched, which will use a 5-nanometer process. If the Zen 5 architecture is switched to Samsung's 3-nanometer process, it will be equivalent to starting over. The market believes that it may be Samsung's release. In other words, AMD is spreading rumors in order to negotiate prices, because under the pressure of Intel's plan to launch the Intel 4 process in 2022, AMD should not act rashly.

AMD launched a new architecture of Ryzen series processors and Vega series graphics cards in 2017. In addition, it adopts TSMC’s 7nm process and has strong performance in performance, R&D and manufacturing cost control. It is currently the largest customer of TSMC’s 7nm process. Now in The market share of PC processors based on the X86 architecture is also approaching 25%. AMD is currently the largest customer of TSMC's 7nm process and has a close cooperative relationship.

According to foreign media

Baineng Cloud Core Advantage Material Number

According to foreign media

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