's ComputeX 2017 Taipei Computer Station, MC editors were still "sweeping" the scene and unearthed the following exciting highlights.
This morning, Asus Computer Global Vice President and General Manager of the Open Platform Business Group Mr. Xu Youjia delivered a speech on Asus’ market strategy at the Asus Computer headquarters. In his speech, Xu Youjia reviewed the development history of ASUS and introduced ASUS's successful experience, current achievements, and prospects for the future to the media. He also said: "Only a lion will become a giant lion, and a pig will only become a fat pig."
Flash memory (NAND Flash) control chip solution leader Phison Electronics (TPEX:8299) announced today (31st) at the 2017 Taipei International Computer Show (COMPUTEX) that it will exhibit a series of industry-leading SSD, USB, SD, and UFS control chip IC and storage solutions. In the second half of this year, Phison Electronics will make every effort to launch a new generation of 3D NAND-supported NAND Flash control chip series products and introduce them into mass production. A number of the latest related storage solutions will be fully unveiled during the exhibition.
Phison Electronics is actively developing next-generation technology, and has long-term cooperation with major international NAND Flash manufacturers, including Toshiba and Micron (Micron), to advance hand in hand with the new generation of 3D NAND technology. According to current engineering test data, compared with the current mainstream 2D NAND process, the new generation of 3D NAND flash memory technology has not only increased reliability by 8 times through Phison Electronics’ unique control chip and firmware design. , the speed of information transmission can be increased by up to 4 times, and the power can be effectively reduced by 20% to achieve energy saving benefits. In fact, the new generation of 3D NAND provides more advantages and performance for PCIe storage solutions.
Phison Electronics Technology Chief Ma Zhongxun pointed out: "Toshiba and Micron's new generation 3D NAND technology not only allows Phison Electronics to provide customers with more energy-saving storage solutions for mobile device applications, but also extends its use to enterprises. The longevity of enterprise-class storage products for server applications will be a major breakthrough in the storage field.
Eric Endebrock, vice president of marketing for Micron Storage Solutions, said: "Today's technology is filled with massive amounts of information, leading system designers to perform higher-end actions. Computing power has also driven the growth of ultra-large data centers. Micron has a number of forward-looking memory technologies that meet the performance requirements of current technological development trends, and the current most cutting-edge 3D NAND solutions will officially help Phison Electronics introduce them. A full range of products utilize higher-speed performance and capacity to create more excellent flash memory solutions.
Phison Electronics officially launches a new generation of 3D NAND with PCIe storage solution PS5008 series this year, which will accelerate the launch of PCIe to replace SATA. Playing the mainstream specifications of SSD (solid state drive), the PS5008 series products include two control chip products, PS5008-E8 and PS5008-E8T. Both of their specifications can provide small storage appearance designs such as M.2 2280 or BGA SSD, and are more capable. At the same time, it meets the performance needs of the mainstream market. At the same time, the PS5008 series products can achieve high-quality features such as low power consumption and low heat while meeting the needs of high performance and high capacity. They can also be used with the current highest-end BGA 1113 packaging technology to achieve small size. The appearance design is used in a number of terminal storage devices.
At this year’s Computer Show, Microsoft , in addition to displaying a series of notebooks and tablets running Windows systems, this time Microsoft emphasized its advantages in productivity, such as on-site Showing on-site painting, Microsoft Azure and Microsoft's layout and application in the IoT field
Titanium Technology held a press conference and Titanium's 2017 new product launch conference today. Captain Tiandu, one of the founders/CTO of Titanium, took the stage to introduce Titanium. The founding background of technology.The captain is a master of overclocking in China. From the earliest days of playing games with hardware to the founding of Titanium Technology, which is "born for e-sports," the captain said that Titanium Technology is determined to become China's top e-sports peripheral brand.
Titanium Product Show
AM4 Mini ITX motherboard exposed, the AB350N-GAMING WIFI from Gigabyte , its power supply system is quite sophisticated, including Panasonic's SO-CAP patch type capacitor, IR's powlrstage integrated MOSFET. Although it only uses the mainstream B350 chipset, the component quality is comparable to Gigabyte's X299 motherboard. It is obvious that Ryzen will become a new choice in the MINI PC market.
Today, through the Gigabyte AORUS X299 motherboard, we have a close look at the standard configuration of the new generation motherboard: M.2SSD heat sink. It can be seen that the workmanship of the heat sink is very solid, and the thickness is close to the chipset heat sink. The concave and convex surface shape can increase the heat dissipation area. The back is also equipped with thermal conductive silicone grease as standard, which can effectively solve the problem of slowdown such as Samsung 960 PRO and 960EVO. .
