Sanfu Xinke general electroplating chemicals
Sanfu Xinke general electroplating chemicals include decorative plating additives, protective plating additives, wax removal special chemicals and oil removal special chemicals, etc.
As shown in the above illustration, the surface treatment of ordinary hardware sanitary ware products generally requires four processing processes: alkaline copper plating, acidic copper plating, nickel plating and chromium plating. Each process requires corresponding special chemicals. Traditional electroplating processes generally require the use of large amounts of cyanide, which is extremely toxic. There are safety risks in procurement, transportation, storage, use, wastewater treatment, as well as the maintenance and disposal of plating tanks and wastewater pools.
After years of research, our company has successfully developed a series of cyanide-free electroplating chemicals. Including cyanide-free alkali copper, cyanide-free silver plating, cyanide-free zinc precipitation, cyanide-free alkali zinc, etc., which have outstanding environmental protection and safety advantages, among which cyanide-free alkali copper is the most representative.
Technical features of cyanide-free alkali copper
cyanide-free alkali copper uses copper salts and multi-complexes that have a synergistic complexing effect on copper, and adds an activator that has an activating effect on iron and zinc alloy bodies to prepare cyanide-free The high-density copper plating solution improves the cathodic polarization of the plating solution, making the dispersion and coverage capabilities of the plating solution surpass those of traditional cyanide copper plating solutions, improving the quality of the plating, realizing the source replacement of highly toxic cyanide, and successfully solving the problem Similar technical problems currently on the market:
A, solving the problem of coating adhesion on different substrates
The original cyanide-free alkaline copper plating process product has poor coating adhesion, which is not as stable as cyanide copper plating, and cannot meet customer requirements for different substrates plating requirements.
Sanfu Xinke’s cyanide-free high-density copper electroplating additive preparation and application technology is based on multi-complexation theory and soft and hard acid-base principles. It selects appropriate copper chelating agents for synergistic complexation, improves the stability of complex , and solves the problem of no The replacement problem of cyanide copper plating liquid on different substrate surfaces; at the same time, adding activator to the plating liquid solves the passivation problem of cyanide-free alkali copper liquid on different substrate surfaces.
B. Solve the problem of plating solution stability
The original cyanide-free alkali copper has the problem of plating solution stability. The new solution can be produced normally. However, after 3 to 6 months of production, the viscosity of the plating solution gradually increases and the current density decreases. , resulting in the inability to continue normal production. At the same time, it is difficult to detect and remove impurities in the components in the plating solution, so it is difficult to maintain a stable state, which may lead to failure of the plating solution.
Sanfu Xinke Company’s cyanide-free high-density copper electroplating additive preparation and application technology selects relatively stable complexes, and the final decomposition product has a small molecular weight and can be removed to avoid accumulation. At the same time, by setting characteristic elements to more accurately detect the content and add supplementary liquid, the components are ensured to be stable, the service life is extended and the cost is reduced.
C, solving the problem of wastewater treatment
Sanfu Xinke's cyanide-free high-density copper electroplating additive preparation and application technology uses easily biodegradable coordination agent, combined with new surfactants and additives. The waste liquid treatment is simple and meets the standards of safe and green discharge.
Comparison of competing products
Sanfu Xinke’s cyanide-free high-density copper electroplating process products have current efficiency and dispersion ability indicators that are superior to foreign representative competing products and traditional cyanide copper plating additives, deposition rate , and plating porosity indicators are superior. It represents competing products abroad but is not as good as traditional cyanide copper plating additives. Cyanide-free high-density copper electroplating process products, foreign representative competitive products and traditional cyanide copper plating additives all have good coating adhesion and coating toughness.
SF-638 cyanide-free alkali copper SEM electron microscope photo 5000 times
product honors
2013: Sanfu Xinke cyanide-free high-density copper electroplating additive was selected into the "National Encouraged Cycle" jointly issued by the National Development and Reform Commission, the Ministry of Environmental Protection, the Ministry of Science and Technology and the Ministry of Industry and Information Technology in 2012 The first item in the Directory of Economic Technology, Technology, and Equipment (First Batch).
Sanfu Xinke was approved by the National Development and Reform Commission to build a "high-density copper electroplating key technology industrialization demonstration project for circular economy that replaces cyanide electroplating."
2018: Sanfu Xinke's "cyanide-free alkali copper electroplating process for zinc alloy parts" was recognized by China Environmental Protection Industry Association as "Key Environmental Protection Practical Technology in 2018".
